METHOD OF FABRICATING SUBSTRATE HAVING THIN FILM OF JOINED

PURPOSE: A method for manufacturing a thin film bonding substrate is provided to increase a thin film area by giving a physical bonding force between a crystal thin film and a heterogeneous substrate. CONSTITUTION: Liquid materials are rinsed on at least one side of a heterogeneous substrate(S1). A...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, DONG HYUN, SHUR, JOONG WON, JUNG, KYUNG SUB, JEON, JONG PIL, KIM, A RA, KIM, MIN JU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a thin film bonding substrate is provided to increase a thin film area by giving a physical bonding force between a crystal thin film and a heterogeneous substrate. CONSTITUTION: Liquid materials are rinsed on at least one side of a heterogeneous substrate(S1). A crystalline bulk is formed on the heterogeneous substrate. The heterogeneous substrate is bonded to one side of the crystalline bulk(S2). The liquid materials are evaporated by applying heat or high vacuum. A crystalline thin film is formed by separating a part of the crystalline bulk(S3). [Reference numerals] (AA) Start; (BB) End; (S1) Rinsing step; (S2) Bonding step; (S3) Thin film separating step