SUBSTRATE PROCESSING APPARATUS

PURPOSE: A substrate processing apparatus is provided to prevent the damage of a support shaft or a susceptor, the generation of particles due to the thermal expansion of the susceptor by reducing the frictional force between the upper surface of the support shaft and the lower surface of the suscep...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YUN, HEE DONG, MA, HEE JEON, NOH, DONG MIN, KIM, SOO CHEON, HA, JOO IL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A substrate processing apparatus is provided to prevent the damage of a support shaft or a susceptor, the generation of particles due to the thermal expansion of the susceptor by reducing the frictional force between the upper surface of the support shaft and the lower surface of the susceptor. CONSTITUTION: A susceptor(30) has a flat shape and is arranged in a chamber(10). A gas ejector(20) sprays gas to a substrate held by the susceptor. A susceptor elevating shaft(40) is combined with the susceptor to raise the susceptor. A supporting shaft(50A) is separated from each other in the edge of the susceptor. A bellows(B) is installed in the susceptor elevating shaft and a support shaft.