SOLDER RESIST FILM, PACKAGE SUBSTRATE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A solder resist film is provided to omit additional process forming a grounding layer, to reduce process lead time, and to optimize performance of a package substrate. CONSTITUTION: A solder resist film(100) comprises a metal thin film(120) inside a solder resist(111,112). The metal thin fi...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, GEON JOO, KANG, DONG HUN, PARK, JIN HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A solder resist film is provided to omit additional process forming a grounding layer, to reduce process lead time, and to optimize performance of a package substrate. CONSTITUTION: A solder resist film(100) comprises a metal thin film(120) inside a solder resist(111,112). The metal thin film is a copper thin film. A package substrate comprises a base substrate formed with an outer layer circuit; a solder resist layer which includes the metal thin film and is formed in the upper side of the outer layer circuit; a viahole which is formed on the solder resist layer and has exposed parts of the outer layer circuit; and a solder coating film which is formed in the upper side of the solder resist layer and the inner wall of the viahole.