PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase matching capability in each position of a wiring board in an exposure process. CONSTITUTION: A wiring pattern(1) forms a wiring pattern by etching a metal layer. A print area(2-5) forms a plurality of alignm...

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Bibliographische Detailangaben
1. Verfasser:	MOK, JEE SOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase matching capability in each position of a wiring board in an exposure process. CONSTITUTION: A wiring pattern(1) forms a wiring pattern by etching a metal layer. A print area(2-5) forms a plurality of alignment marks(11-16). Even if deformation or distortion is generated in each print area of a wiring plate, a matching error is measured in each print area(2-5). The alignment mark is simultaneously formed when the wiring pattern is formed in the print area.