SPUTTERING TARGET TA SHEET AND MANUFACTURING METHOD OF THE SAME

PURPOSE: A Ta(tantalum) sheet for a sputtering target and a manufacturing method thereof are provided to improve purity because the size of final grains of the Ta sheet is below 35 micrometers and is composed of a structure in which orientation is priority. CONSTITUTION: A Ta sheet manufacturing met...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, HYUN MIN, IM, SUNG CHUL, LIM, YONG DEOK, SONG, KYU YOUNG, GWON, HYEOK CHEON, WOO, SANG MO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS FORGE FURNACES FORGING GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS HAMMERING MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS PERFORMING OPERATIONS PRESSING METAL PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS PUNCHING METAL RIVETING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PURPOSE: A Ta(tantalum) sheet for a sputtering target and a manufacturing method thereof are provided to improve purity because the size of final grains of the Ta sheet is below 35 micrometers and is composed of a structure in which orientation is priority. CONSTITUTION: A Ta sheet manufacturing method includes the following steps: Melted and casted Ta ingots or billets are cold-forged and cold-rolled in order and are annealed at 1173-1573K in order to make the mean diameter of the grains to below 35 micrometers. The cold-forging step includes the following steps: A forging process is implemented by applying a plastic working rate of 40-60%. An intermediate forging process is implemented at below the recrystalization temperature of Ta in order to improve processability.