LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD

PURPOSE: A device for electroplating copper of lower internal stress is provided to deposit copper on a relatively thin board without possibilities of bowing, curling, or wrapping the board. CONSTITUTION: A device for electroplating copper of lower internal stress comprises; a step for contacting on...

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Bibliographische Detailangaben
Hauptverfasser:	HAMM GARY, KARAYA NARSMOUL, ALLARDYCE GEORGE R
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE: A device for electroplating copper of lower internal stress is provided to deposit copper on a relatively thin board without possibilities of bowing, curling, or wrapping the board. CONSTITUTION: A device for electroplating copper of lower internal stress comprises; a step for contacting one or more copper ion sources, a compound including one or more inhibitors and one or more promoters with a board; and a step for obtaining current density less than MattCDmax throughout the board in order to deposit the mat copper on the board by applying current to the board.