BACK LIGHT ASSEMBLY AND METHOD FOR ASSEMBLING THE SAME

PURPOSE: A back light assembly and a manufacturing method thereof are provided to discharge heat generated in an LED package through a PCB(Printed Circuit Board) and a bottom cover by forming the PCB into an L-shape instead of the deletion of a lamp housing and a radiating pad. CONSTITUTION: A PCB(6...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JUN HYUNG, LEE, SANG DAE, SEO, HAN TAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PURPOSE: A back light assembly and a manufacturing method thereof are provided to discharge heat generated in an LED package through a PCB(Printed Circuit Board) and a bottom cover by forming the PCB into an L-shape instead of the deletion of a lamp housing and a radiating pad. CONSTITUTION: A PCB(6) is attached to an inner side and a floor surface of a bottom cover(2). The PCB is bent into an L-shape. One or more grooves(8) are formed on a bending portion of the PCB. A plurality of LED packages(16) are embedded in the PCB. A panel guide(10) is placed on the side border area of the bottom cover. A top cover(14) covers the panel guide.