COPPER-BASED SLIDING MATERIAL

PURPOSE: A copper-based sliding material is provided to improve welding resistance by prevent a direct contact between a surface of a Cu alloy matrix and a surface of an opposite shaft. CONSTITUTION: A copper-based sliding material(1) comprises a steel white metal layer(2) and a Cu alloy layer(3). T...

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Bibliographische Detailangaben
Hauptverfasser:	TODA KAZUAKI, TUJIMOTO KENTARO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS BEARINGS BLASTING CASTING CHEMISTRY ELEMENTS OR CRANKSHAFT MECHANISMS ENGINEERING ELEMENTS AND UNITS FERROUS OR NON-FERROUS ALLOYS FLEXIBLE SHAFTS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEATING LIGHTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING METALLURGY PERFORMING OPERATIONS POWDER METALLURGY ROTARY BODIES OTHER THAN GEARING ELEMENTS SHAFTS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THERMAL INSULATION IN GENERAL TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WEAPONS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	PURPOSE: A copper-based sliding material is provided to improve welding resistance by prevent a direct contact between a surface of a Cu alloy matrix and a surface of an opposite shaft. CONSTITUTION: A copper-based sliding material(1) comprises a steel white metal layer(2) and a Cu alloy layer(3). The Cu alloy layer contains 0.5-15wt% of Sn, 0.2-5wt% of inorganic compound particles, and the rest of Cu and incidental impurities. A mean diameter of the inorganic compound particles is 1-10μm. A true density ratio of a Cu alloy matrix with respect to the inorganic compound particles is 0.6-1.4. A thermal expansion coefficient ratio of the Cu alloy matrix with respect to the inorganic compound particles satisfies 1.5-3.0. A mean distance between the inorganic compound particles dispersed in the Cu alloy matrix is 5-50μm.