SUBSTRATE BONDING APPARATUS AND METHOD OF ASSEMBLING PARTS THEREOF

PURPOSE: A substrate bonding apparatus and an assembling method thereof are provided to reduce fraction defects by applying uniform pressure on a substrate by using a pad part. CONSTITUTION: A table(130) is arranged in a vacuum chamber. The table includes a first magnetic material. A hot plate(140)...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, GANG IN, PARK, DO KWANG, PARK, KWAN WOO, WOO, KWANG IL, JANG, BYEUNG JO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A substrate bonding apparatus and an assembling method thereof are provided to reduce fraction defects by applying uniform pressure on a substrate by using a pad part. CONSTITUTION: A table(130) is arranged in a vacuum chamber. The table includes a first magnetic material. A hot plate(140) faces the table and includes a second magnetic material. A pad part(150) applies the pressure of the table to the substrate.