SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily mount an electronic component and a connection terminal and to reduce manufacturing costs. CONSTITUTION: A shielding layer(13) is formed on the upper surface of a substrate. Multiple shielding vias are formed...

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1. Verfasser:	YIM, NAM GYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	YIM, NAM GYUN
description	PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily mount an electronic component and a connection terminal and to reduce manufacturing costs. CONSTITUTION: A shielding layer(13) is formed on the upper surface of a substrate. Multiple shielding vias are formed along the circumference of the substrate. An electronic component(20) is mounted on the lower surface of the substrate. The shielding vias are electrically connected to the shielding layer. A connection terminal(30) is adhered to the lower surface of the substrate.
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title	SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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