SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily mount an electronic component and a connection terminal and to reduce manufacturing costs. CONSTITUTION: A shielding layer(13) is formed on the upper surface of a substrate. Multiple shielding vias are formed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YIM, NAM GYUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily mount an electronic component and a connection terminal and to reduce manufacturing costs. CONSTITUTION: A shielding layer(13) is formed on the upper surface of a substrate. Multiple shielding vias are formed along the circumference of the substrate. An electronic component(20) is mounted on the lower surface of the substrate. The shielding vias are electrically connected to the shielding layer. A connection terminal(30) is adhered to the lower surface of the substrate.