METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR CHIP PRIOR TO BONDING

PURPOSE: An apparatus and method for inspecting a semiconductor chip before a bonding process are provided to attach chips without damage to a substrate by identifying defective chips before a chip attaching process. CONSTITUTION: A first chip handling unit(92) picks up a chip(5) from a supply stati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MARTE ANDREAS, STADELMANN TIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING
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