METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR CHIP PRIOR TO BONDING

PURPOSE: An apparatus and method for inspecting a semiconductor chip before a bonding process are provided to attach chips without damage to a substrate by identifying defective chips before a chip attaching process. CONSTITUTION: A first chip handling unit(92) picks up a chip(5) from a supply stati...

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Bibliographische Detailangaben
Hauptverfasser:	MARTE ANDREAS, STADELMANN TIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING
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Beschreibung
Zusammenfassung:	PURPOSE: An apparatus and method for inspecting a semiconductor chip before a bonding process are provided to attach chips without damage to a substrate by identifying defective chips before a chip attaching process. CONSTITUTION: A first chip handling unit(92) picks up a chip(5) from a supply station. The first chip handling unit transmits the chip from a first transmission location to a second chip handling unit(94). The second chip handling unit transfers the chip to a target location on a substrate(6) and arranges the chip. A third chip handling unit(93) receives the chip from the first chip handling unit and transmits the chip to the second chip handling unit. The third chip handing unit includes a chip handing device(10) with a vacuum orifice.