LIGHT-EMITTING DEVICE

LIGHT-EMITTING DEVICE

PURPOSE: A light emitting device package is provided to electrically connect a lead frame to a light emitting device without wire bonding and to prevent the degradation of brightness of the light emitting device package. CONSTITUTION: A lead frame(120) is mounted on a body(110). A light emitting dev...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KONG, JI UN, SEO, IL
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A light emitting device package is provided to electrically connect a lead frame to a light emitting device without wire bonding and to prevent the degradation of brightness of the light emitting device package. CONSTITUTION: A lead frame(120) is mounted on a body(110). A light emitting device(130) is mounted on a cavity(C1). The light emitting device includes a first conductivity type semiconductor layer(131), an active layer(132) and a second conductivity type semiconductor layer(133). The active layer leans at a first angle from the bottom surface of the cavity. The cavity is filled with resin(140).