LIGHT EMITTING DIODE ARRAY AND BACK LIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING THE LIGHT EMITTING DIODE ARRAY

PURPOSE: A LED package and a light guide plate are provided to improve the lighting efficiency and the heat dissipation efficiency of an LED package by using a combining member for the LED package and a light guide plate. CONSTITUTION: A printed circuit board(110) supplies driving power to each of m...

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Bibliographische Detailangaben
Hauptverfasser:	KWEON, YOUNG MIN, PARK, SANG RYEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PURPOSE: A LED package and a light guide plate are provided to improve the lighting efficiency and the heat dissipation efficiency of an LED package by using a combining member for the LED package and a light guide plate. CONSTITUTION: A printed circuit board(110) supplies driving power to each of multiple LED packages(120). The printed circuit board includes a base substrate(111), an insulating layer(113), a circuit pattern layer(115), a solder resist layer(117) and an inserting hole(119). The insulating layer electrically insulates the base substrate from the circuit pattern layer. The LED package includes a package frame(121), an LED chip(123), a Zener diode(125), a first and a second lead frame(127,129). The package frame includes a package body(121a), an opening part(121b) and a sealing part(121c).