THE LIGHT EMITTING DEVICE PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

THE LIGHT EMITTING DEVICE PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to reduce manufacturing costs by processing the upper side of exposed metal protrusion with electroless plating or OSP(Organic Solderability Preservatives). CONSTITUTION: A device pad(160) is formed on the lower...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HAN, YOUNG JU, HWANG, DEOK KI, BAE, SEOK HUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A light emitting device package and a manufacturing method thereof are provided to reduce manufacturing costs by processing the upper side of exposed metal protrusion with electroless plating or OSP(Organic Solderability Preservatives). CONSTITUTION: A device pad(160) is formed on the lower side of a light emitting structure(50). The light emitting structure includes a first conductive semiconductor layer(120), an active layer(130), and a second conductive semiconductor layer(140). A metal protrusion(180) is formed on the device pad. An insulation layer(185) covers the lower side of the light emitting structure. A substrate pad(182) is formed on the upper side of the metal protrusion.