METHOD OF BONDING DEVICE OF AN ELECTRODE AND A WIRE AND BONDING DEVICE

PURPOSE: A method for manufacturing a bonding device of an electrode and a wire and a bonding device manufactured by the same are provided to accurately bond the wire to the electrode of a substrate by using a syringe apparatus and a position adjusting apparatus. CONSTITUTION: A wire(10) is supplied...

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Bibliographische Detailangaben
Hauptverfasser:	MOON, HAK BEOM, KIM, SOO JUNG, CHO, JIN HYUNG, KWON, HAE CHUL, KIM, BUNG JU, JANG, YOON HYUNG, KIM, CHEOL HWAN, BANG, SUC HYUN, HWANG, HO JUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a bonding device of an electrode and a wire and a bonding device manufactured by the same are provided to accurately bond the wire to the electrode of a substrate by using a syringe apparatus and a position adjusting apparatus. CONSTITUTION: A wire(10) is supplied to a syringe(20). Adhesive is adhered in one end of the wire. The syringe is mounted on position adjusting apparatus(30). The adhesive is dried. The position adjusting apparatus is moved.