LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve the energy efficiency of the light emitting device package by reducing reflexibility on an interface of the light emitting device package to maximize light extraction efficiency. CONSTITUTION: A light...

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Bibliographische Detailangaben
1. Verfasser:	RA, SEUNG HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve the energy efficiency of the light emitting device package by reducing reflexibility on an interface of the light emitting device package to maximize light extraction efficiency. CONSTITUTION: A light emitting device(15) emits light. A first light transmissive material(11) transmits light emitted from the light emitting device. A second light transmissive material(13) discharges light from the first light transmissive material to the outside. A first antireflection unit(21) and a second antireflection unit(31) are formed between the first light transmissive material and the second light transmissive material. The first antireflection unit and the second antireflection unit have moth-eye patterns.