APPARATUS AND METHOD FOR SEPARATING SUBSTRATE

PURPOSE: An apparatus and a method for separating a substrate are provided to remove a junction part for prevent the penetration of foreign materials. CONSTITUTION: A substrate support part(110) comprises a laminate. A laminated substrate is formed on a carrier member. A plate corner separating part...

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Bibliographische Detailangaben
1. Verfasser: JUNG, JOUNG SUL
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:PURPOSE: An apparatus and a method for separating a substrate are provided to remove a junction part for prevent the penetration of foreign materials. CONSTITUTION: A substrate support part(110) comprises a laminate. A laminated substrate is formed on a carrier member. A plate corner separating part(120) comprises a substrate cutting unit and a substrate bending unit. The substrate cutting unit cuts the laminated substrate edge portion of the laminate. The substrate bending unit forms a gap between the laminated substrate and carrier member. A substrate separation part(130) is inserted into a gap formed between the laminated substrate and carrier member. The substrate separation part separates the laminated substrate from carrier member. [Reference numerals] (125) Air storage unit; (127) Control part; (127a) First driving unit; (127b) Second driving unit; (127c) Third driving unit