PCB JIG FOR ENVIRONMENT TEST OF LED PACKAGE

PURPOSE: A printed circuit substrate jig for light-emitting diode package environment test is provided to facilitate operation state maintenance through a power supply terminal in the light intensity measurement, environment test, and life expectancy test and to appropriately maintain heating state...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HAN, JI HUN, YOON, YANG GI, HYUNG, JAE PIL, I, MU SEOK, LEE, YOUNG JOO, LEE, CHANG HOON, LIM, HONG WOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A printed circuit substrate jig for light-emitting diode package environment test is provided to facilitate operation state maintenance through a power supply terminal in the light intensity measurement, environment test, and life expectancy test and to appropriately maintain heating state of a light-emitting diode package for surface mount which is sensitive to heat. CONSTITUTION: A light-emitting diode package(2) is mounted on an installation part(1). Light-emitting diode packages of various sizes are connected to an light-emitting diode package connecting part(3) through lead free. An electric power connecting part(4) of a jig facilitates the connection of electric power in outside. [Reference numerals] (AA) LED Package(center)