APPARATUS FOR INSPECTING AND SORTING CHIP PACKAGES

PURPOSE: An inspection and classification apparatus of a chip package is provided to inspect and classify the chip package without a lead frame. CONSTITUTION: An inspection and classification apparatus of a chip package comprises rotary units(1, 3), a chip inspection unit(2), and a chip classificati...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN HSIN CHENG, WANG BILY, CHEN KUEI PAO
Format: Patent
Sprache:eng ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE: An inspection and classification apparatus of a chip package is provided to inspect and classify the chip package without a lead frame. CONSTITUTION: An inspection and classification apparatus of a chip package comprises rotary units(1, 3), a chip inspection unit(2), and a chip classification unit(4). The rotary units comprise a plurality of air inflow-outflow ports installed within a plurality of receiving units. The rotary units selectively purchase the chip package within the plurality of receiving units and carry a plurality of chip packages. The chip inspection unit is contiguous to the rotary units and includes a chip inspection module. The chip inspection module inspects the chip package. The chip classification unit is contiguous to the rotary units and includes a chip classification module. The chip classification module classifies the plurality of chip packages.