STRUCTURE OF ELECTROLESSLY PALLADIUM AND GOLD PLATED FILMS AND PROCESS FOR MAKING THE SAME, ASSEMBLED STRUCTURE OF PALLADIUM AND GOLD PLATED FILMS BONDED WITH COPPER OR COPPER-PALLADIUM WIRE AND ASSEMBLING PROCESS THEREFOR

PURPOSE: An electroless palladium and gold-plated film structure and a production method thereof, and an assembly structure and method of a palladium and gold-plated film coupled with a copper or copper-palladium wire are provided to reinforce the wire-coupling force between a copper or palladium-copper wire and a bonding pad by employing a palladium and gold plating layers instead of a nickel layer. CONSTITUTION: An electroless palladium and gold-plated film structure comprises a palladium plating layer(12,14) which is formed on a bonding pad(10) through a substitution process or a substitution and reduction process and a gold plating layer(16) which is formed on the palladium plating layer through a substitution process, a reduction process, or the combination thereof. A method for manufacturing an electroless palladium and gold plated film comprises the steps of: preparing a bonding pad; forming a palladium plating layer on the bonding pad through a substitution process; and forming a gold plating layer on the palladium plating layer through a substitution process, a reduction process, or the combination thereof.