SUBSTRATE FOR ELECTRONIC CIRCUITS

Support materials for printing electrically conductive structures by means of inkjet printing with inks which contain conductive particles lead to low resistances for the printed structures without thermal post-treatment when they contain a microporous layer with a mean pore size of less than 100 nm...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SCHMIDT WOLFGANG, BARTH GREMMEL KIRSTEN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	Support materials for printing electrically conductive structures by means of inkjet printing with inks which contain conductive particles lead to low resistances for the printed structures without thermal post-treatment when they contain a microporous layer with a mean pore size of less than 100 nm as an outer layer.