RADIATION-SENSITIVE RESIN COMPOSITION, CURED FILM FOR DISPLAY DEVICE, METHOD FOR FORMING THE CURED FILM FOR DISPLAY DEVICE, AND THE DISPLAY DEVICE

PURPOSE: A radiation-sensitive resin composition, a cured film for a display device, a method for forming the cured film for the display device, and the display device are provided to improve the heat resistance characteristic, chemical resistance characteristic, transmittance, and curing performance of the cured film. CONSTITUTION: A radiation-sensitive resin composition includes copolymer with 0.1-35 mole% of a structure unit represented by chemical formula 1, polymeric compound with ethylenically unsaturated bonds, and a radiation-sensitive polymerization initiator. In chemical formula 1, R1 is a hydrogen atom or a methyl group; X is represented by chemical formula 2 or 3, Y is an oxygen atom or a sulfur atom; and n is the integer of 1 to 12. In chemical formula 2, R2 and R3 are respectively hydrogen atoms, C1 to C12 linear or branched alkyl groups, or C6 to C20 aryl groups; and one or whole of hydrogen atoms in the aryl groups is capable of being substituted with C1 to C12 linear or branched alkyl groups. In chemical formula 3, R4 is a hydrogen atom, C1 to C12 linear or branched alkyl group, or C6 to C20 aryl group; one or whole of hydrogen atoms in the aryl groups is capable of being substituted with C1 to C12 linear or branched alkyl groups; m is the integer of 0 to 3; and if the number of R4 is plural, R4s are capable of being identical or different.