IMAGING DEVICE PACKAGE, METHOD OF MANUFACTURING THE IMAGING DEVICE PACKAGE, AND ELECTRONIC APPARATUS

PURPOSE: A photographing device package, a method for manufacturing thereof, and an electronic device thereof are provided to minimize the photographing device package by eliminating a bonding area of a support body. CONSTITUTION: A wire(13) electrically connects a photographing device chip to a sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ITOH TOHRU, TSUKUDA YUKIHIKO, SEO RYOTARO, YAMADA TOMOYASU
Format: Patent
Sprache:eng ; kor
Schlagworte:
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