IMAGING DEVICE PACKAGE, METHOD OF MANUFACTURING THE IMAGING DEVICE PACKAGE, AND ELECTRONIC APPARATUS

IMAGING DEVICE PACKAGE, METHOD OF MANUFACTURING THE IMAGING DEVICE PACKAGE, AND ELECTRONIC APPARATUS

PURPOSE: A photographing device package, a method for manufacturing thereof, and an electronic device thereof are provided to minimize the photographing device package by eliminating a bonding area of a support body. CONSTITUTION: A wire(13) electrically connects a photographing device chip to a sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ITOH TOHRU, TSUKUDA YUKIHIKO, SEO RYOTARO, YAMADA TOMOYASU
Format: Patent
Sprache:eng ; kor
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
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Beschreibung
Zusammenfassung:PURPOSE: A photographing device package, a method for manufacturing thereof, and an electronic device thereof are provided to minimize the photographing device package by eliminating a bonding area of a support body. CONSTITUTION: A wire(13) electrically connects a photographing device chip to a substrate in an edge of the substrate around the photographing device chip. A support body(14) supports an optical member(16) for the substrate. A bonding unit(15) bonds the support body to the substrate by sealing the wire and a wire bonding terminal in the edge of the substrate.