FBGA PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: An FBGA package and a manufacturing method thereof are provided to improve the reliability of an FBGA package manufacturing process by securing design and expandability of a top wiring part. CONSTITUTION: An expansion pad(212b1) is formed on the upper side of an interposer(202). The expansi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, JONG SOO, CHOI, JIN WON, JUN, CHAN BONG, NAM, AN SIK, SEO, CHI WOONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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