FBGA PACKAGE AND METHOD FOR MANUFACTURING THE SAME

FBGA PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: An FBGA package and a manufacturing method thereof are provided to improve the reliability of an FBGA package manufacturing process by securing design and expandability of a top wiring part. CONSTITUTION: An expansion pad(212b1) is formed on the upper side of an interposer(202). The expansi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, JONG SOO, CHOI, JIN WON, JUN, CHAN BONG, NAM, AN SIK, SEO, CHI WOONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: An FBGA package and a manufacturing method thereof are provided to improve the reliability of an FBGA package manufacturing process by securing design and expandability of a top wiring part. CONSTITUTION: An expansion pad(212b1) is formed on the upper side of an interposer(202). The expansion pad is electrically connected to a rewiring pad(212a1) through a via hole. A semiconductor chip is adhered to the interposer in contact with the expansion pad. An encapsulant(220) molds the front of the semiconductor chip. A solder ball(222) is attached to the rewiring pad.