SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to prevent a supporting plate to be bent by controlling thermal stress in a manufacturing process which spreads insulating resin. CONSTITUTION: A semiconductor element(3) is replaced on a supporting plate(1). The semiconductor element has a circuit element surface in which a plurality of first electrodes(5) is formed. A first insulation layer(7) comprises a plurality of first openings(9) which expose the plurality of first electrodes. A second insulation layer(17) coats the top of the supporting plate and the side of the semiconductor element. A wiring layer(20) contacts the top of the first insulation layer and the second insulation layer. The wiring layer is electrically connected to the plurality of first electrodes.