CANISTER

PURPOSE: A canister is provided to improve the efficiency of atomic layer deposition and chemical vapor deposition by selectively and simultaneously employing VFC and bubbler methods. CONSTITUTION: A canister comprises a body(110), a top cover, first and second supply lines(131,132), a supply valve...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SHIN, HYUN KOOCK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PURPOSE: A canister is provided to improve the efficiency of atomic layer deposition and chemical vapor deposition by selectively and simultaneously employing VFC and bubbler methods. CONSTITUTION: A canister comprises a body(110), a top cover, first and second supply lines(131,132), a supply valve unit(140), a discharge line(151), a discharge valve unit(160), and a controller. The first and second supply lines have different lengths and supply a reactive source, which reacts a chemical source, into the body. The supply valve unit is coupled to one side of the top cover and connected to the first and second supply lines. The discharge line discharges a processing source, which is formed by interaction between the chemical source and the reactive source, from the body. The discharge valve unit is coupled to the other side of the top cover and connected to the discharge line. The controller controls the operation of the supply valve unit so that the first and second supply lines are opened and closed based on the amount of the chemical source remaining in the body.