APPARATUS FOR TRANSFERRING SEMICONDUCTOR PACKAGE

PURPOSE: An apparatus for transferring a semiconductor package is provided to prevent a semiconductor package, which is loaded on the inside of a tray, from being attached to a rear side of the tray. CONSTITUTION: An apparatus(10) for transferring a semiconductor package includes a plurality of tray...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, YONG JIN, JEONG, HYECK JIN, KIM, HEUI SEOG, PARK, YONG KI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PURPOSE: An apparatus for transferring a semiconductor package is provided to prevent a semiconductor package, which is loaded on the inside of a tray, from being attached to a rear side of the tray. CONSTITUTION: An apparatus(10) for transferring a semiconductor package includes a plurality of trays(100). A tray comprises a main body(101), a plurality of pocket portions(110), and an adhesion preventing portion(140). The pocket portions are formed in the main body and accept a semiconductor package. The adhesion preventing portion is arranged in a rear side of the main body. The main body has a rectangular flat plate shape. The pocket portion has a penetration hole in the center and has a rectangular shape which has one longer side along an axis. The adhesion preventing portion includes a plurality of protrusions which are arranged in the rear side of the pocket portion.