Method for fabricating film circuit substrate and method for fabricating chip package comprising the same
PURPOSE: A method for manufacturing a film circuit board and a method for manufacturing a chip package are provided to improve the reliability of a device by cutting a film circuit board with a relatively small cut surface. CONSTITUTION: A base film(320) includes a chip mount area and an isolation a...
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| creator | SON, DAE WOO HAN, SANG UK LEE, KWAN JAI CHUNG, YE CHUNG HA, JEONG KYU KIM, YUN YOUNG |
| description | PURPOSE: A method for manufacturing a film circuit board and a method for manufacturing a chip package are provided to improve the reliability of a device by cutting a film circuit board with a relatively small cut surface. CONSTITUTION: A base film(320) includes a chip mount area and an isolation area. The isolation area is divided into two chip mount areas and includes a cut area(A) and a non-cut area(B). A preliminary wire pattern with a first height is formed on the base film. A wire pattern(341) with a second height is formed in the cut area by selectively etching the preliminary wire pattern of the cut area. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Method for fabricating film circuit substrate and method for fabricating chip package comprising the same |
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