Method for fabricating film circuit substrate and method for fabricating chip package comprising the same

PURPOSE: A method for manufacturing a film circuit board and a method for manufacturing a chip package are provided to improve the reliability of a device by cutting a film circuit board with a relatively small cut surface. CONSTITUTION: A base film(320) includes a chip mount area and an isolation a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SON, DAE WOO, HAN, SANG UK, LEE, KWAN JAI, CHUNG, YE CHUNG, HA, JEONG KYU, KIM, YUN YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a film circuit board and a method for manufacturing a chip package are provided to improve the reliability of a device by cutting a film circuit board with a relatively small cut surface. CONSTITUTION: A base film(320) includes a chip mount area and an isolation area. The isolation area is divided into two chip mount areas and includes a cut area(A) and a non-cut area(B). A preliminary wire pattern with a first height is formed on the base film. A wire pattern(341) with a second height is formed in the cut area by selectively etching the preliminary wire pattern of the cut area.