SEMICONDUCTOR PACKAGE

PURPOSE: A semiconductor package is provided to suppress failure even if long time passes by reducing heat which is generated inside a semiconductor package. CONSTITUTION: In a semiconductor package, a substrate has a first side and a second side. The substrate includes a base part(10) and a substra...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, KWANG HYUN, RHEE, WON SANG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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Beschreibung
Zusammenfassung:	PURPOSE: A semiconductor package is provided to suppress failure even if long time passes by reducing heat which is generated inside a semiconductor package. CONSTITUTION: In a semiconductor package, a substrate has a first side and a second side. The substrate includes a base part(10) and a substrate wireless signal unit which is formed in the base part. A semiconductor chip(100) transmits and receives data to the substrate and a radio signal. A thermoelectric unit(70) controls the temperature of the semiconductor chip and the substrate. The heat generated from the semiconductor chip is emitted through a heat sink(90) to outside.