NOVEL EPOXY COMPOUNDS AND THEIR FLAME-RETARDING EPOXY RESIN COMPOSITIONS

PURPOSE: An epoxy resin compound is provided to obtain superior fire retardancy without fire retardant agent or flame-retarding aid, suitable for a semiconductor encapsulant, a printed circuit board, an adhesive, paint, a mold, etc. CONSTITUTION: An epoxy resin is in the chemical formula 1. In the c...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, CHUNG HEE, KIM, KYUNG MAHN, JO, BOUNG SUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE: An epoxy resin compound is provided to obtain superior fire retardancy without fire retardant agent or flame-retarding aid, suitable for a semiconductor encapsulant, a printed circuit board, an adhesive, paint, a mold, etc. CONSTITUTION: An epoxy resin is in the chemical formula 1. In the chemical formula 1, R is C1-12 alkyl or phenyl respectively and independently, p is integer of 0-2, and n is integer of 0-10. The epoxy resin is manufactured by epoxidation of compound in the chemical formula 2 by epihalohydrin compound. In the chemical formula 2, R is C1-C12 alkyl or phenyl respectively and independently, p is integer of 0-2. The epoxy resin composition comprises the epoxy resin in the chemical formula 1 and hardener.