CAMERA MODULE AND METHOD OF MANUFACTURING THE IMAGE SENSOR MODULE

PURPOSE: A camera module covering the side part of the image sensor chip is provided to reliably protect the image sensor chip from an external shock. CONSTITUTION: An image sensor chip(110) has a first side and a second side. A housing(140) covers the side part of the image sensor chip in order to...

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Bibliographische Detailangaben
Hauptverfasser:	KONG, YUNG CHEOL, RYU, HAN SUNG, CHO, YONG HOE, SEO, BYOUNG RIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A camera module covering the side part of the image sensor chip is provided to reliably protect the image sensor chip from an external shock. CONSTITUTION: An image sensor chip(110) has a first side and a second side. A housing(140) covers the side part of the image sensor chip in order to exposure the second side of the image chip. The housing includes an electromagnetic wave shielding film(200). An optical system(130) is arranged on the first side of the image sensor chip. The optical system guides the light to the image sensor chip from an object. A conductive structure(210) electrically interlinks a grounding pad(112) and an electromagnetic wave shielding film.