WIRE TOOL

WIRE TOOL

PURPOSE: A wire tool is provided to enhance heat resistance and durability since a protective layer is formed, so the damage to diamond particles due to foreign materials and oxidation is prevented. CONSTITUTION: A wire tool comprises wires(100), a plating layer(120), diamond particles(130), and a p...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JEONG, YONG HWA, RYOO, MIN HO, MOON, HWAN GYUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
BROACHING
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
FILING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
PLANING
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SAWING
SCRAPING
SEMICONDUCTOR DEVICES
SHEARING
SLOTTING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:PURPOSE: A wire tool is provided to enhance heat resistance and durability since a protective layer is formed, so the damage to diamond particles due to foreign materials and oxidation is prevented. CONSTITUTION: A wire tool comprises wires(100), a plating layer(120), diamond particles(130), and a protective layer(140). The wire comprises metal. The wire comprises one selected from a group of steel, stainless steel and tungsten carbide. The plating layer is formed on the surface of the wire. The plating layer comprises Ni. The diamond particles are installed on the plating layer. The protective layer is formed between the diamond particle and the plating layer. The protective layer comprises Ti, and two or more elements selected from a group of Al, Si, Cr and V. The protective layer is formed in order to make contact with the plating layer. The protective layer is formed in order to protect the whole surface of the diamond particle.