ADHESIVE DISPENSER FOR FABRICATING SEMICONDUCTOR PACKAGE

PURPOSE: An adhesive dispenser for manufacturing a semiconductor package is provided to eliminate remaining adhesive from a needle after an adhesive applying process with respect to the pad of a lead frame is completed. CONSTITUTION: An adhesive dispenser for manufacturing a semiconductor package in...

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Bibliographische Detailangaben
1. Verfasser:	KOO, JAE HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: An adhesive dispenser for manufacturing a semiconductor package is provided to eliminate remaining adhesive from a needle after an adhesive applying process with respect to the pad of a lead frame is completed. CONSTITUTION: An adhesive dispenser for manufacturing a semiconductor package includes an adhesive containing unit(30), an applying head, a head moving unit, and an eliminating unit(50). The applying head includes a needle(21). The needle applies adhesive contained in the adhesive containing unit to the pad(42) of a lead frame. The head moving unit moves the applying head. The eliminating unit eliminates remaining adhesive from a needle based on a sucking unit(60). The sucking unit is installed at the path of the needle.