METHOD FOR FORMING PATTERN ON THE BASIS OF REFLOW PROCESS AND METHOD FOR MANUFACTURING SOLAR CELL USING THE SAME

PURPOSE: A pattern formation method based on a reflow process and a solar cell manufacturing method using the same are provided to improve productivity and reliability of pattern formation by precisely controlling the shape of a sidewall layer. CONSTITUTION: A substrate(10) is prepared. A thin film...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, DONG JEE, LEE, SI WOO, LEE, YOO JIN, HWANG, MOON SICK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PURPOSE: A pattern formation method based on a reflow process and a solar cell manufacturing method using the same are provided to improve productivity and reliability of pattern formation by precisely controlling the shape of a sidewall layer. CONSTITUTION: A substrate(10) is prepared. A thin film layer(20) is formed on the top of the substrate. A dummy pattern(30) is formed on a part of upper side of the thin film layer. A trench(T) is formed by etching(P) a part of the thin film layer using laser scribing. A sidewall layer which covers one side of the trench by soldering the dummy pattern is formed. The thin film layer comprises at least one among an insulation layer, a metal layer, and a semiconductor layer. A top conductive layer is formed on the front surface of the substrate.