AQUEOUS COPPER NANO INK

PURPOSE: An aqueous copper nano ink composition is provided to ensure excellent oxidation resistance, excellent adhesive property with a flexible substrate, and to facilitate an ink-jetting property and the line width of wires. CONSTITUTION: An aqueous copper nano ink composition comprises 20 ~ 70 w...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHOI, YOUNG MIN, LEE, SUN SOOK, OH, SEOK HEON, KIM, EUI DUK, RYU, BEYONG HWAN, JEONG, SUN HO, SONG, HAE CHON, PAIK, CHOONG HOON, LEE, BYONG SEOK, SON, WON IL, LEE, JI YOON, PARK, SUN JIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE: An aqueous copper nano ink composition is provided to ensure excellent oxidation resistance, excellent adhesive property with a flexible substrate, and to facilitate an ink-jetting property and the line width of wires. CONSTITUTION: An aqueous copper nano ink composition comprises 20 ~ 70 weight% of copper nano particles, 10 ~ 45 weight% of water, 15 ~ 40 weight% of polyhydric alcohols, 0.1 ~ 2 weight% of water-based dispersion agents, and 0.01 ~ 1 weight% of binders. The copper nanoparticles have 100nm or less of an average particle diameter surface-modified to have a hydrophilic property. The copper nano particles are obtained by treating copper nano particles synthesized through a solution reducing method or a vaporizing method with a surface modification liquid including surfactants.