MANUFACTURING METHOD FOR LED

PURPOSE: A method for manufacturing an LED is provided to simplify a manufacturing process by separating each LED device from a sapphire substrate through one device separation process. CONSTITUTION: A buffer layer(20) and a shock absorbing layer(30) are deposited on a sapphire substrate(10). An N type semiconductor layer(40) is deposited on the shock absorbing layer. An active layer(50) is deposited on the N type semiconductor layer. A P type semiconductor layer(60) is deposited on the active layer. A P type pad(70) is formed on the P type semiconductor layer. A protection layer(80) is attached to the upper side of the P type pad.