WAFER LEVEL SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PURPOSE: A wafer level semiconductor package and a manufacturing method thereof are provided to prevent an exfoliation phenomenon and cracks generated on a junction part between different materials of a semiconductor package, thereby improving reliability of the semiconductor package. CONSTITUTION:...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG, GI JO, JEON, BYOUNG YOOL, KANG, IN SOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!