LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING A LIGHT EMITTING DIODE PACKAGE

PROBLEM TO BE SOLVED: To provide a light emitting diode package, a lighting apparatus having the same, and a method for manufacturing a light emitting diode package.SOLUTION: According to the present invention, there is provided a light emitting diode package including: a package substrate; a light...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JIN HA, JEON, CHUNG BAE, KIM, KYU SANG, PARK, MOO YOUN, JEONG, JAE YOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a light emitting diode package, a lighting apparatus having the same, and a method for manufacturing a light emitting diode package.SOLUTION: According to the present invention, there is provided a light emitting diode package including: a package substrate; a light emitting diode chip mounted on the package substrate; and a wavelength conversion layer formed to cover at least a portion of an upper surface of the light emitting diode chip when a surface formed by the light emitting diode chip when viewed from above is defined as the upper surface of the light emitting diode chip. The wavelength conversion layer is formed so as not to exceed the area of the upper surface of the light emitting diode chip and includes a flat surface parallel to the upper surface of the light emitting diode chip and curved surfaces connecting the corners of the upper surface of the light emitting diode chip.