SEMICONDUCTOR HOUSING PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING THE SEMICONDUCTOR HOUSING PACKAGE AND PROCESSOR-BASED SYSTEM COMPRISING THE SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected t...

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Bibliographische Detailangaben

Hauptverfasser:	KIM, DONG HAN, LIM, SO YOUNG, LEE, PA LAN, PARK, SUNG WOO, PARK, JIN WOO, KIM, JUNG HWAN, BAE, KWANG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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