SEMICONDUCTOR HOUSING PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING THE SEMICONDUCTOR HOUSING PACKAGE AND PROCESSOR-BASED SYSTEM COMPRISING THE SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR HOUSING PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING THE SEMICONDUCTOR HOUSING PACKAGE AND PROCESSOR-BASED SYSTEM COMPRISING THE SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected t...

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Bibliographische Detailangaben
Hauptverfasser: KIM, DONG HAN, LIM, SO YOUNG, LEE, PA LAN, PARK, SUNG WOO, PARK, JIN WOO, KIM, JUNG HWAN, BAE, KWANG JIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.