SILICON BASED MODULE, METHOD FOR FORMING A SILICON BASED MODULE, AND SILICON BASED ARRAY

PURPOSE: A silicon based module and a formation method thereof, and a silicon based array are provided to form a larger linear array without disturbance between modules by overlapping chips and chip assemblies. CONSTITUTION: A silicon based module(100) comprises a first chip assembly and a second ch...

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Bibliographische Detailangaben
Hauptverfasser:	PHILLIPS SCOTT J, DOLAN BRYAN R, MEYERS JOHN P, CELLURA MARK A, DINGMAN LYLE G, NYSTROM PETER J
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PURPOSE: A silicon based module and a formation method thereof, and a silicon based array are provided to form a larger linear array without disturbance between modules by overlapping chips and chip assemblies. CONSTITUTION: A silicon based module(100) comprises a first chip assembly and a second chip assembly. The first chip assembly comprises a first driver die equipped with a first silicon chip and an electric circuit and is fixed to a substrate. The second chip assembly comprises a second driver die equipped with a second silicon chip and an electric circuit and is fixed to the substrate. Each part of the first and second chip assemblies is arranged in the longitudinal direction of the substrate.