MOLDING APPARATUS

PURPOSE: A molding apparatus for forming a thin molding on the top side of a semiconductor chip is provided to remove a cause of failure by easily flowing molding resin into the gap a semiconductor chip and a mold. CONSTITUTION: In a molding apparatus for forming a thin molding on the top side of a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOON, CHUL KEUN, LEE, BYOUNG DO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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