MOLDING APPARATUS

PURPOSE: A molding apparatus for forming a thin molding on the top side of a semiconductor chip is provided to remove a cause of failure by easily flowing molding resin into the gap a semiconductor chip and a mold. CONSTITUTION: In a molding apparatus for forming a thin molding on the top side of a...

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Bibliographische Detailangaben
Hauptverfasser:	YOON, CHUL KEUN, LEE, BYOUNG DO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A molding apparatus for forming a thin molding on the top side of a semiconductor chip is provided to remove a cause of failure by easily flowing molding resin into the gap a semiconductor chip and a mold. CONSTITUTION: In a molding apparatus for forming a thin molding on the top side of a semiconductor chip, a first mold(10) comprises a first side(1) and a second side(2) which are opposite to each other and also includes a cavity(5). A second mold(20) comprises a third side(21) and a fourth side(2) which are opposite to each other and also includes a second cavity(25). The first mold and the second mold are mutually spaced from each other by a driving unit. A molding resin supply unit(30) supplies the molding resin to first and second cavities A vibration generator(40) supplies vibration to one of the first mold and/or the second mold.