INSULATION SUBSTRATE AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD THEREOF

PURPOSE: An insulation substrate and a printed circuit board manufacturing method thereof are provided to fill a thermosetting material having high resistance into a via. CONSTITUTION: A first rinse layer(120) fills a via hole(117). A second resin layer(130) is laminated in an insulating layer(111)...

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Bibliographische Detailangaben
Hauptverfasser:	CHO, CHUNG WOO, KIM, JONG YONG, LEE, YONG DUK, JEON, KI JU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: An insulation substrate and a printed circuit board manufacturing method thereof are provided to fill a thermosetting material having high resistance into a via. CONSTITUTION: A first rinse layer(120) fills a via hole(117). A second resin layer(130) is laminated in an insulating layer(111) through a vacuum laminate method. The first rinse layer includes a thermosetting material to increase the reliability and heat resistance of the via hole. A second resin layer includes a photosensitivity material and covers a pattern excluding a contact part to protect the pattern.