MANUFACTURING METHOD OF DUAL IN-LINE PACKAGE FOR OPTICAL MOUSE SENSOR WITH BASED PCB

MANUFACTURING METHOD OF DUAL IN-LINE PACKAGE FOR OPTICAL MOUSE SENSOR WITH BASED PCB

PURPOSE: A dual in-line package manufacturing method for a PCB based optical mouse sensor is provided to reduce the manufacturing cost of a chip package by replacing a PMF(Pre Molding Frame) into a PCB and a pin. CONSTITUTION: A chip is formed by cutting a wafer in a sawing process. A die bonding pr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, DONG OCK, CHA, JEE SOO
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PHYSICS
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Beschreibung
Zusammenfassung:PURPOSE: A dual in-line package manufacturing method for a PCB based optical mouse sensor is provided to reduce the manufacturing cost of a chip package by replacing a PMF(Pre Molding Frame) into a PCB and a pin. CONSTITUTION: A chip is formed by cutting a wafer in a sawing process. A die bonding process is executed based on a PCB(Printed Circuit Board). A gold wire is bonded in a wire bonding process. The chip and the wire are sealed in a dispenser process. A cap is molded in a capping process. A pin is inserted to the PCB in a pin insertion process.